| PART |
Description |
Maker |
| BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP
AMERICAN BRIGHT OPTOELECTRONICS CORP
|
| BM-41EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| CDR04BX104AKUM CDR03BP331B CDR01B151B CDR01BX561B |
CAP 0.15UF 10% X7R SMD-1812 BULK BASE/BARR/SOLDER R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.1 uF, SURFACE MOUNT, 1812
Chips
MIL-PRF-55681/Chips Part Number Example CDR01 thru CDR06
|
AVX, Corp.
AVX Corporation
|
| TNPW2010 TNPW0805 TNPW1206 TNPW0402 TNPW1210 TNPW2 |
Ultra-stable thin film technology; Pulse resistant;
Thin Film Flat Chip Resistors;
High-Stability
Thin Film, Rectangular, Resistor Chips
Thin Film/ Rectangular/ Resistor Chips
|
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| SIDC01D60SIC2SAWN SIDC01D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 4A die sawn
Diodes - HV Chips - 600V, 4A die unsawn
|
Infineon
|
| SIDC03D30SIC2SAWN SIDC03D30SIC2UNSAWN |
Diodes - HV Chips - 300V, 10A die sawn
Diodes - HV Chips - 300V, 10A die unsawn
|
Infineon
|
| SSB-COB11565GW |
115mm x 65mm VIEW AREA, CHIPS ON BOARD LED BACKLIGHT, 565mm GREEN, 220 CHIPS, 4.2V 1100mA
115mm x 65mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green
|
List of Unclassifed Manufacturers
LUMEX INC.
ETC
|
| 2KG028075JL |
SWITCHING DIODE CHIPS
|
Silan Microelectronics Joint-stock
|
| SB320-1.8 SB3100-1.8 SB340-1.8 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
| SB540-2.0 SB520-2.0 SB5100-2.0 |
Chips for Schottky Diodes
|
Gunter Seniconductor GmbH.
|
| MBR1045 |
Chips for Schottky Diodes
|
Gunter Seniconductor Gm...
|
